intelligent MICROSYSTEM LABORATORY (i M L)

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The laboratory is equipped with a variety of instruments for fabrication and characterization microscale devices and integrated systems. This laboratory is available mainly to MRC and ISC investigators and their students. It can also be used by other UMR faculty members, students and companies for collaborative research. If you are interested in using the equipment, please contact Dr. Chang-Soo Kim (573-341-4529, ckim@mst.edu).

ELECTRONIC INSTRUMENTS

§ Electrochemical workstations (Gamry FAS1 and Gamry 750); 3-electrode multi-functional (potentiostat, galvanostat, impedance) instrument.

§ Multichannel electrochemical multiplexer (Gamry ECM8); 8-channel multiplexer for sequential multichannel monitoring.

§ Semiconductor parameter characterization system (Keithley 4200SCS); multi-channel programmable voltage and current source-measurement-unit.

§ Nanovoltmeter (Keithley 2182); dual-channel digital instrument for low level measurements of DC volts.

§ Picocurrent source (Keithley 225); constant current source capable of sourcing current of 100 pA.

ANALYTICAL INSTRUMENTS

§ Spectrometer (Ocean Optics USB2000-FLG); Gated CCD-based spectrofluorometer (with 350-1000 nm range).

§ Optical power/energy meter (Newport 2935-C); Dual channel low-power optical meter (with a silicon detector of 190-1100 nm range).

§ Ion/gas analysis system (ORION 940); analytical instrument for ion/gas monitoring and analysis (pH, electrolytes, dissolved oxygen, carbon dioxide, temperature).

§ Fiber optic oxygen meter (WPI OXY-MICRO-AOT); (dissolved) oxygen monitoring system with a luminescence optical microprobe.

§ Galvanic oxygen meter (WTW Inolab); (dissolved) oxygen monitoring system with a galvanic oxygen probe.

§ Conductivity meter (Oakton con 100); conductivity measurement of liquid samples.

§ Electronic microbalance (Mettler AE240); dual range analytical balance (200 mg and 40 mg range).

PROCESS EQUIPMENT

§ Mask aligner/exposure system (Cobilt CA-800); 4”-wafer photolithography process equipment.

§ Spin coater (Laurel WB-400B-6NPP-LITE); 4”-wafer photoresist spin coating equipment.

§ Dry etcher (Plasma Etch PE-200); Bench top reactive ion etcher, 300W.

§ Wafer bonder (Dynatex DXB-525); Wafer bonding system.

§ Wedge wire bonder (Kulicke & Soffa 4526); manual wedge wire bonder for interconnection and packaging of microsensor/microactuator.

§ Microprobe station (Cascade REL 100); manual microprobe station for testing of ICs in wafer or packaged platform.

Last update: 08/10/08