Microgravity Solder Joint Quality

Joseph Ferry
Missouri University of Science and Technology
Glenn Research Center
NASA Mentors: Peter Struk, John Easton


Abstract
The scheme currently used to supply spare parts and components to the ISS can not feasibly be applied to a long duration manned lunar outpost or Mars exploration mission. The Component-Level Electronic Assembly Repair (CLEAR) project attempts to reduce mission mass and volume requirements for spare electronic components by developing tools and techniques that will allow astronauts to diagnose and repair malfunctioning electronics during a mission. This paper presents a study of solder joint formation in microgravity; it is found that solder joints formed in microgravity show increased voiding compared to joints soldered in 1g.

NOTE: This internship was sponsored by NASA's Exploration Systems Mission Directorate.
Joseph Ferry is a graduate student in the department of Mechanical and Aerospace Engineering at Missouri University of Science and Technology. Originally from St. Louis, MO, Joseph is working towards a master's degree in Aerospace Engineering. He has spent two summers working for NASA through the Missouri Space Grant program, and upon graduation hopes to enter the workforce. He is currently researching atmospheric pressure plasma discharges and their application in aerodynamic control of flight vehicles.
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