INVITED TALKS & TECHNICAL PRESENTATIONS
2019/02 Measuring Adhesion of MXene, Adhesion Society, Hilton Head, South Carolina
2018/11 Static and Dynamic Fracture of AgNW/Graphene Composite Film, ASME 2018 International Mechanical Engineering Congress and Exposition, Pittsburgh, Pennsylvania
2018/11 Adhesion of AgNW/Graphene composite film, ASME 2018 International Mechanical Engineering Congress and Exposition, Pittsburgh, Pennsylvania
2018/11 Measuring adhesion of MXene, ASME 2018 International Mechanical Engineering Congress and Exposition, Pittsburgh, Pennsylvania
2018/06 Characterization adhesion of AgNW/Graphene composite film, ASME Society of Experimental Mechanics, Greenville, South Carolina
2018/02 Adhesion of Silver Nano Wire and Graphene Composite Film, Adhesion Society, San Diego, California
2017/11 Simultaneous extraction of mixed-mode traction-separation relations for interfaces, ASME 2017 International Mechanical Engineering Congress and Exposition, Tampa, Florida
2017/03 Using far-field measurements to determine mixed-mode traction-separation relations for interfaces, University of Texas at San Antonio, San Antonio, Texas
2017/02 Characterizing interfacial sliding of Through-Silicon-Via by nanoindentation, Adhesion Society Annual Conference, St. Petersburg, Florida
2017/02 Direct extraction of vector traction-separation relations for interfaces, Adhesion Society Annual Conference, St. Petersburg, Florida
2016/04 Multi-scale and multi-physics at micro-scale: experiment, metrology, and modeling, at Missouri University of Science and Technology, Rolla, Missouri
2015/11 Determining mixed-mode traction-separation relations of Si/Epoxy interface, ASME 2015 International Mechanical Engineering Congress and Exposition, Houston, Texas
2015/06 Interfacial delamination of Cu thin films on silicon substrate with epoxy as adhesion promoter, Semi-conductor Research Symposium, Atlanta, Georgia.
2015/05 Effect of grain boundary sliding on TSV extrusions, 65th Electronic Components and Technology Conference (ECTC), San Diego, California.
2014/10 Nano-scale mechanical properties of polyurea aerogel, 13th International Workshop on Stress-Induced Phenomena and Reliability in Microelectronics, Austin, Texas.
2014/10 Effect of grain structures on TSV extrusions, International Microelectronics Assembly and Packaging Society, San Diego, California.
2014/07 Interfacial fractures in micro-electronic devices at Dalian Institute of Technology, Dalian, China
2014/05 Nano-indentation experiment on TSV, University of North Texas, Denton, Texas.
2014/04 Unified model of local bond between deformed steel rebar in concrete: indentation analogy theory and validation, ACI conference, Kansas City, Missouri.
2013/06 Characterization of interfacial properties of TSV/Si interface, Semi-conductor Research Symposium, Georgia Institute of Technology, Atlanta, Georgia.