INVITED TALKS & TECHNICAL PRESENTATIONS

2019/02          Measuring Adhesion of MXene, Adhesion Society, Hilton Head, South Carolina

2018/11          Static and Dynamic Fracture of AgNW/Graphene Composite Film, ASME 2018 International Mechanical Engineering Congress and Exposition, Pittsburgh, Pennsylvania

2018/11          Adhesion of AgNW/Graphene composite film, ASME 2018 International Mechanical Engineering Congress and Exposition, Pittsburgh, Pennsylvania

2018/11          Measuring adhesion of MXene, ASME 2018 International Mechanical Engineering Congress and Exposition, Pittsburgh, Pennsylvania

2018/06          Characterization adhesion of AgNW/Graphene composite film, ASME Society of Experimental Mechanics, Greenville, South Carolina

2018/02          Adhesion of Silver Nano Wire and Graphene Composite Film, Adhesion Society, San Diego, California

2017/11          Simultaneous extraction of mixed-mode traction-separation relations for interfaces, ASME 2017 International Mechanical Engineering Congress and Exposition, Tampa, Florida

2017/03          Using far-field measurements to determine mixed-mode traction-separation relations for interfaces, University of Texas at San Antonio, San Antonio, Texas

2017/02          Characterizing interfacial sliding of Through-Silicon-Via by nanoindentation, Adhesion Society Annual Conference, St. Petersburg, Florida

2017/02          Direct extraction of vector traction-separation relations for interfaces, Adhesion Society Annual Conference, St. Petersburg, Florida

2016/04          Multi-scale and multi-physics at micro-scale: experiment, metrology, and modeling, at Missouri University of Science and Technology, Rolla, Missouri

2015/11          Determining mixed-mode traction-separation relations of Si/Epoxy interface, ASME 2015 International Mechanical Engineering Congress and Exposition, Houston, Texas

2015/06          Interfacial delamination of Cu thin films on silicon substrate with epoxy as adhesion promoter, Semi-conductor Research Symposium, Atlanta, Georgia.

2015/05          Effect of grain boundary sliding on TSV extrusions, 65th Electronic Components and Technology Conference (ECTC), San Diego, California.

2014/10          Nano-scale mechanical properties of polyurea aerogel, 13th International Workshop on Stress-Induced Phenomena and Reliability in Microelectronics, Austin, Texas.

2014/10          Effect of grain structures on TSV extrusions, International Microelectronics Assembly and Packaging Society, San Diego, California.

2014/07          Interfacial fractures in micro-electronic devices at Dalian Institute of Technology, Dalian, China

2014/05          Nano-indentation experiment on TSV, University of North Texas, Denton, Texas.

2014/04          Unified model of local bond between deformed steel rebar in concrete: indentation analogy theory and validation, ACI conference, Kansas City, Missouri.

2013/06          Characterization of interfacial properties of TSV/Si interface, Semi-conductor Research Symposium, Georgia Institute of Technology, Atlanta, Georgia.